4 Umaleko we-PCB wokuVelisa uMveliso weXabiso elitshiphu lePCB uMvelisi eTshayina
Iinkcukacha zeMveliso
Isicelo:Ezobuchwephesha, zomkhosi, amayeza, njalo njalo
Isiqinisekiso: ISO/TS16949/ROHS/TS16949
Umbala wemaski yeSolder:Buhlaza obuMnyama obuBlue obuMhlophe
Inani loMaleko: 1-22 Iileya
Inkonzo:Injineli yobuNjineli, elungileyo emva kwenkonzo, ixabiso lokhuphiswano
PCB Standard:IPC-A-610 D/IPC-III Standard
Ukunyamezela umngxuma:PTH: ±2mil, NTPH: ±2mil
Ukunyamezela ukutyeba kwebhodi: ±10%
Iinkonzo ze-OEM/ODM: | |||
Iileya | I-1-22 imigangatho | Min.ububanzi bomgca | 2mil |
Ubungakanani bebhodi enkulu (enye&kabiniicala) | 700*1200mm | Min.annular ring ububanzi: visa | 3mil |
Ukugqitywa komphezulu | I-HAL (nge-Pb yasimahla), ifakwe i-Ni/Au,Isilivere yokuntywiliselwa, IMM Ni/Au, I MM Sn,igolide eqinile, i-OSP, njl | Ubungqingqwa bebhodi encinci(i-multilayer) | 4 umaleko:0.4mm;6 umaleko:0.6mm;8 umaleko:1mm; 10 umaleko:1.2mm |
Izinto zebhodi | FR-4;iTG ephezulu;i-CTI ephezulu;i-halogen yasimahla;amaza aphezulu (i-rogers, i-ta-conic,PTFE,nelson,ISOLA,polyclinic 370 HR);ubhedu obunzima | Ubukhulu bokwambathwa (Indlela:Untywiliselo Ni/Au) | Uhlobo lokucwenga: IMM Ni, Ubuncinci/Ubukhulu obukhulu:100/150U” Uhlobo lokucwenga: IMM Au, uMn./Ubukhulu obukhulu:2/4U” |
Ulawulo lwe-impedance | ± 10% | Umgama phakathiumgca ukuya emphethweni webhodi | Ulwandlalo: 0.2mm V-CUT: 0.4mm |
Isiseko sobunzima bobhedu (Ngaphakathikunye nomgangatho wangaphandle) | Min.ubukhulu:1/3 OZ Max.ukutyeba:6OZ | Ubungakanani bomngxuma omncinci(ubukhulu bebhodi ≥2mm) | Umlinganiselo≤16 |
Ugqitywe ubukhulu bobhedu | Iileya zangaphandle:Ubuncinci 1 OZ,Ubukhulu obukhulu 10 OZ Iileya zangaphakathi: Ubuncinci obuncinci 0.5OZ, Ubukhulu obukhulu 6 OZ | Ubukhulu bebhodi yebhodi (enye&macala amabini) | 6mm |
Bhala umyalezo wakho apha kwaye uwuthumele kuthi