40 * 40mm ubhedu PCB & PCBA umzi-mveliso SMD umgangatho ophezulu MCPCB 3535 led PCB umenzi
Ingcaciso yeMveliso
Isakhono semveliso
Iiparamitha zobuchwephesha kunye namandla enkqubo ye-metal substrate (MCPCB) | |
INTO | INGCACISO |
Umphezulu | I-LF HASL, igolide yokuntywiliselwa, isilivere yokuntywiliselwa, i-OSP |
Umaleko | Icala elinye, i-Multilayer enamacala amabini kunye nesakhiwo esikhethekileyo |
Ubungakanani obukhulu bePCB | 240mmx1490mm OKANYE 490x1190mm |
PCB ubukhulu | 0.4-3.0mm |
Ubunzima beFoil yobhedu | H 1/2/3/4(oz) |
Ubunzima bomaleko we-Insulation | 50/75/100/125/150/175/200(um) |
Metal Base ubukhulu | iAluminiyam(1100/3003/5052/6061), iAluminiyam yobhedu |
Metal Base ubukhulu | 0.5/0.8/1.0/1.2/1.6/2.0/3.2/5.0(mm) |
Ukubunjwa | Die punching/CNC Route/V-Cut |
Uvavanyo | 100% evulekileyo&yovavanyo olufutshane |
Ukubumba ukunyamezela | Die Punching <+- 0.05mm,CNC Indlela <+-0.15mm,V-CUT |
Ukunyamezela komngxuma | +-0.5mm |
Min.Hole Diameter | Icala elinye 0.5/Double side PTH0.3MM |
Imaski yesolder | luhlaza/mhlophe/mnyama/bomvu/mthubi |
Min.letter ukuphakama | 0.8mm |
Indawo yomgca | 0.15 |
Min.ububanzi beleta | 0.15 |
umbala wesikrini | blue/white/black/red/yellow |
Umngxuma okhethekileyo | Indawo ejongeneyo/umngxuma wekomityi/engcwatywe ngomngxuma/itanki engcwatyiweyo |
Ifomathi yefayile | Gerber,Pro-tel,Power PCB,Auto CAD njl |
Ukwaziswa kwe-MCPCB
I-MCPCB sisishunqulelo se-Metal core PCBS, kuquka i-aluminium esekwe kwi-PCB, i-PCB esekwe elubhedu kunye ne-PCB esekwe ngentsimbi.
Ibhodi esekelwe kwi-Aluminiyam lolona hlobo luqhelekileyo.Izinto ezisisiseko ziquka i-aluminium core, i-FR4 eqhelekileyo kunye nobhedu.Ibonisa umaleko we-thermal clad ochitha ubushushu ngendlela efanelekileyo kakhulu ngelixa ukupholisa amacandelo.Okwangoku, iAluminiyam esekwe kwiPCB ithathwa njengesisombululo kumandla aphezulu.Ibhodi esekelwe kwi-aluminium ingathatha indawo yebhodi esekelwe kwi-ceramic, kwaye i-aluminium inika amandla kunye nokuqina kwimveliso iziseko ze-ceramic zingenako.
I-Copper substrate yenye yezona zixhobo zetsimbi ezibiza kakhulu, kwaye i-thermal conductivity yayo ingcono ngamaxesha amaninzi kune-aluminium substrates kunye ne-iron substrates.Ilungele ukutshatyalaliswa kobushushu obuphezulu beesekethe eziphezulu zefrikhwensi, amacandelo kwimimandla enenguqu enkulu kwiqondo lokushisa eliphezulu neliphantsi kunye nezixhobo zonxibelelwano ezichanekileyo.
I-Thermal insulation layer yenye yeendawo eziphambili ze-copper substrate, ngoko ubukhulu befoyile yobhedu ubukhulu becala yi-35 m-280 m, enokufikelela kumthamo owomeleleyo wangoku.Xa kuthelekiswa ne-aluminium substrate, i-copper substrate inokufezekisa umphumo ongcono wokutshatyalaliswa kobushushu, ukwenzela ukuba kuqinisekiswe ukuzinza kwemveliso.
Ubume beAluminiyam PCB
ISekethe yeCopper Layer
Umaleko wobhedu wesekethe uphuhliswa kwaye uhlonyelwe ukwenza isekethe eprintiweyo, i-substrate ye-aluminium inokuthwala umsinga ophakamileyo kune-FR-4 efanayo kunye nobubanzi obufanayo.
I-Insulating Layer
Uluhlu lwe-insulating yi-teknoloji engundoqo ye-aluminium substrate, eyona nto idlala imisebenzi ye-insulation kunye nokushisa ukushisa.I-aluminium substrate insulating layer iyona mqobo omkhulu we-thermal kwisakhiwo semodyuli yamandla.Okungcono ukuhanjiswa kwe-thermal ye-insulating layer, ngokusebenzayo ngakumbi ukusasaza ubushushu obuveliswa ngexesha lokusebenza kwesixhobo, kunye nokunciphisa ubushushu besixhobo,I-Metal substrate.
Luluphi uhlobo lwetsimbi esiya kukhetha njenge-insulating metal substrate ?
Kufuneka siqwalasele i-coefficient yokwandisa i-thermal, i-thermal conductivity, amandla, ubunzima, ubunzima, umgangatho womhlaba kunye neendleko ze-substrate yensimbi.
Ngokuqhelekileyo, i-aluminiyam inexabiso eliphantsi kunobhedu.Izinto ezifumanekayo ze-aluminiyam ziyi-6061, 5052, 1060 njalo njalo.Ukuba kukho iimfuno eziphakamileyo zokuqhuba kwe-thermal, iipropathi zomatshini, iipropati zombane kunye nezinye iimpawu ezikhethekileyo, iipleyiti zobhedu, iipleyiti zensimbi ezingenasici, iipleyiti zetsimbi kunye ne-silicon plates yensimbi.
Ukusetyenziswa kwe-MCPCB
1.Umsindo : Igalelo, i-amplifier ephumayo, i-amplifier elinganiselayo, isandisi somsindo, isandisi samandla.
I-2.Unikezelo lwamandla: Ukutshintsha umlawuli, i-DC / AC converter, umlawuli we-SW, njl.
I-3.I-Automobile: Umlawuli we-elektroniki, ukucima, umlawuli wokubonelela ngombane, njl.
I-4.Ikhompyutha: Ibhodi ye-CPU, i-floppy disk drive, izixhobo zokubonelela ngombane, njl.
I-5.Iimodyuli zaMandla: I-Invert-er, i-slid-state relays, iibhulorho zokulungisa.
6.Izibane kunye nezibane: izibane zokugcina amandla, iintlobo ezahlukeneyo zezibane ze-LED ezinemibala, ukukhanya kwangaphandle, ukukhanya kweqonga, ukukhanya komthombo.