Indlela ethe ngqo yobushushu iMCPCB kunye neSink-pad MCPCB, iCopper Core PCB, iCopper PCB
Iinkcukacha zeMveliso
Izinto ezisisiseko:Alu/ ubhedu
Ukutyeba kobhedu:0.5/1/2/3/4 OZ
Ukutyeba kwebhodi: 0.6-5mm
Min.Ububanzi bomngxuma:T/2mm
Min.Ububanzi bomgca: 0.15mm
Min.Isithuba somgca: 0.15mm
Ukugqitywa komphezulu: i-HASL, igolide yokuntywiliselwa, igolide ekhanyayo, isilivere ecwecwe, i-OSP
Igama lento: MCPCB LED PCB Ibhodi yesekethe eprintiweyo, iAluminiyam PCB, undoqo wobhedu
PCB
I-V-cut angle: 30 °,45 °,60 °
Ukunyamezela imilo:+/-0.1mm
Umngxuma DIA unyamezelo:+/-0.1mm
I-Thermal Conductivity: 0.8-3 W / MK
I-E-test voltage: 50-250V
Amandla e-Peel-off: 2.2N / mm
Warp okanye jija:
Ubunzima bodonga lwe-PTH:> 0.025mm
Hayi. | Izinto | Isalathiso |
1 | Unyango loMphezulu | I-HASL, igolide yokuntywiliselwa, iFlash gold, isilivere ecwecwe, i-OSP |
2 | Umaleko | Icala elinye |
3 | PCB Ukutyeba | 0.6-5mm |
4 | Ukugula kweFoil yobhedu | 0.5-4Oz |
5 | Min umngxuma idayamitha | T/2mm |
6 | Ububanzi bomgca omncinci | 0.15mm |
7 | Iileya | I-1-4 imigangatho |
8 | Ubungakanani bebhodi enkulu | 585mm*1185mm |
9 | Ubungakanani bebhodi encinci | 3mm*10mm |
10 | Ubukhulu bebhodi | 0.4-6.0mm |
11 | Indawo encinci | 0.127mm |
12 | PTH ubukhulu bodonga | >0.025mm |
13 | I-V-cut | 30/45/60 degree |
14 | Ubungakanani be-V-cut | 5mm*1200mm |
15 | Min.bag pad | 0.35mm |
Unikezelo: I-MCPCB enecala elinye, i-MCPCB emacala amabini, i-MCPCB ephindwe kabini, i-MCPCB egobekayo, i-MCPCB yotshintshiselwano ngokuthe ngqo, i-eutectic bonding flip -chip MCPCB.I-MCPCB yethu ilungiselelwe.
I-1.isiseko se-aluminiyam ye-PCB yokukhanya kwe-LED yemodyuli yokukhanya ekhokelela
2.aluminiyam substrate PCB
I-3.isiseko se-aluminiyam yobhedu ene-laminate PCB
4.aluminiyam base PCB
1) izinto eziphathekayo: FR-4, iCopper, iAluminium esekelwe
2) umaleko: 1-4
3) ubukhulu bobhedu: 0.5oz, 1.0oz, 2oz, 3oz, 4oz
I-4) ukugqitywa komphezulu: i-HASL, i-OSP, igolide yokuntywiliselwa, isilivere yokuntywiliselwa, igolide yeFlash, isilivere ePlated.
5) umbala wemaski ye-solder: eluhlaza, emnyama, emhlophe.
6) i-angle ye-V-cut: 30, 45,60 degree
7) Uvavanyo lombane lwe-E: 50-250V
8) Isiqinisekiso: UL, ISO9001, ROHS ,SGS,CE
UbuGcisa be-MC PCB
;Uhlobo | Into | Umthamo | Uhlobo | Into | Umthamo |
Iileya | / | 1-4 | Ubungakanani bomngxuma | Ubungakanani bomngxuma wokugaya | 0.6-6.0mm |
Laminate | Uhlobo lweLaminate | I-Aluminiyam, intsimbi, kunye nesiseko sokuhlukaniswa sobhedu | Ukunyamezela komngxuma | ±0.05mm | |
Ubungakanani | 1000*1200mm 60081500mm | Ukunyamezela kwendawo yomngxuma | ±0.1mm | ||
Ubukhulu bebhodi | 0.4mm-3.0mm | Umgangatho wento | 5:1 | ||
Ukunyamezela kobunzima bebhodi | ±0.1mm | Imaski yesolder | Min solder ibhulorho | 4mil | |
Ubukhulu be-Dielectric | 0.075-0.15mm | Impedance | Ukunyamezela kokunyamezela | ±10% | |
Isekethe | Ubuncinci ububanzi / indawo | 5mil/5mil | Amandla e-Peel | ≥1.8 N/mm | |
Ukunyamezela ububanzi / indawo | ±15% | Ukumelana nomphezulu | ≥1*105M | ||
Ubunzima bobhedu | Ngaphakathi nangaphandle | 0.5-10 OZ | ≥1*106M | ||
Ukuxhathisa umthamo | |||||
I-Thermal conductivity | Ukushisa okuphantsi kwe-conductivity 1.0-1.5 | ||||
Ukushisa okuphakathi kwe-conductivity 1.5-1.8 | |||||
Ukuqhuba okuphezulu 2.0-8.0 | |||||
I-solder fioat | 260℃, 10mil, Akukho blister, Akukho kuzimisela | ||||
Imvume | ≤4.4 |