Imaski yeSolder eluhlaza INK FR4 Gh60 8 Umaleko 94V0 iGold Plating eRigid PCB Menzi
Ingcaciso yeMveliso
Inani leeLayers: 2-60 layer
Izinto ezisisiseko: Fr4, Fr-4, ALU, Roger, lead free
Ukutyeba kwebhodi: 0.2mm-3.5mm
Min.Ubungakanani bomngxuma: 0.1mm
Min.Ububanzi bomgca: 3mils
Min.Isithuba somgca: 3mils
Ukugqitywa komphezulu: igolide yokuntywiliselwa, i-OSP
Igama lemveliso: FR4 gh60 8 umaleko 94vo igolide plating engqongqo PCB umenzi
Umsebenzi: PCBA Board Service Prototype PCB Assembly
ukugqitywa komphezulu: Igolide yokuntywiliselwa / i-tin / Au / isilivere / i-tin, i-OSP, i-HASL
Isicelo: Consumer Electronics
Umbala wemaski yeSolder: Uhlaza Mhlophe Obomvu Oluhlaza Mnyama
Uhlobo lwe-PCBA: Ibhodi yokwenziwa kwe-Electronics
Umaleko: 1-48 Iileya (zibandakanya iRigid-Flex PCB)
I-PCB iFireproof: 94v0
Isiqinisekiso: ISO/ISO/ROHS/TS16949
Ukutyeba kobhedu: 1-2oz
Uyilo loYilo lweCB
Nceda Ubonelele: Umzobo weSchematic, ithala leencwadi (iphepha ledatha), ubume beDXF, iimfuno zoyilo.
Ukwenziwa kwePCB
Nceda Ubonelelwe: ifayile yeGerber njl.
Ukufumana izixhobo
Nceda Ubonelelwe: Uluhlu lwe-BOM lubandakanya inombolo yeCandelo elineenkcukacha kunye nokuMiselwa.
indibano PCB
Okungasentla kweefayile zePCB kunye noluhlu lweBOM.
FR-4 PCB Ubuchwephesha bezakhono
Into | Umthamo oqhelekileyo | Ubungakanani bomda | Into | Umthamo oqhelekileyo | Ubungakanani bomda |
Uluhlu No. | 2-16 | ≤20 | Max.Ubunzima bobhedu ( umaleko wangaphakathi) | I-4 OZ | 5OZ |
Ubukhulu bebhodi engundoqo | 0.075-2.0mm | 0.05-3.0mm | Max.Ubunzima bobhedu ( umaleko wangaphandle) | I-4 OZ | 6OZ |
imiz.PTH ukuya kobhedu | 165.1um | 152.4um | Min.isithuba phakathi SMD pads for S/M ibhulorho | 203.2um | 177.8um |
Ubukhulu bebhodi (amacala amabini) | 0.3-3.2mm | 0.3-4mm | Ubuncinci ububanzi/ubude bentsomi | 127um/762um | 101.6um / 609.6um |
Ubukhulu bebhodi(Uluhlu oluninzi) | 0.6-3.2mm | 0.6-4mm | Lula unyamezelo lobungakanani | ±101.6um | ± 76.2um |
Ukunyamezela ukutyeba kwebhodi (T≤0.8mm) | 0.1mm | 0.075mm | Goba kwaye ujije (T≤1mm) | ≤0.75% | ≤0.5% |
Ukunyamezela kobunzima bebhodi(T>0.8mm) | ±10% | ±5% | Goba kwaye ujije (T≤1mm) | ≤0.5% | ≤0.3% |
Min.ububanzi bomgca | 76.2um | 63.5um | Ukuchaneka komngxuma ukuya kumngxuma | ±0.05mm | / |
Ubuncinci besithuba somgca | 68.58um | 63.5um | Uluhlu lolawulo lwe-impedance | ±10% | ±8% |
Ubuncinci bedayamitha yomngxuma | 0.2mm | 0.15mm | Ubungakanani bombono (0.2mm) | 10:1 | 12:1 |
Ukunyamezela komngxuma wokucinezela i-diameter | 0.05mm | 0.05mm | Ubungakanani bemveliso egqityiweyo | 55-600mm | 10-620mm |
indlela yeprofayile | CNC, V-CUT, Ukubetha okanye ukungunda | ||||
Unyango lomphezulu | I-EING, i-OSP, isilivere yokuntywiliselwa, i-OSP ekhethiweyo + ENIG | ||||
Uhlobo lweLaminate | I-FR-4.0, FR-4.1(i-TG eqhelekileyo, i-TG ephakathi, i-TG ephezulu), i-CEM-3, |