I-chip ithengiswa njani kwibhodi yesekethe?

I-chip yinto esiyibiza ngokuba yi-IC, equlunqwe ngumthombo we-crystal kunye nokupakishwa kwangaphandle, kuncinci njenge-transistor, kunye ne-CPU yethu yekhompyutheni yinto esiyibiza ngokuba yi-IC.Ngokubanzi, ifakwe kwi-PCB ngokusebenzisa izikhonkwane (oko kukuthi, Ibhodi yesekethe oyikhankanyileyo), eyahlulahlulwe kwiipakethi zevolumu ezahlukeneyo, kubandakanya iplagi kunye nepetshi.Kukho nezinye ezingafakwanga ngokuthe ngqo kwi-PCB, njenge-CPU yekhompyutha yethu.Ukuze kube lula ukutshintshwa, kugxininiswe kuyo ngokusebenzisa iziseko okanye izikhonkwane.Iqhuma elimnyama, elifana newotshi ye-elektroniki, litywinwe ngokuthe ngqo kwiPCB.Ngokomzekelo, ezinye ii-hobbyists ze-elektroniki azinayo i-PCB efanelekileyo, ngoko ke kunokwenzeka ukuba kwakhiwe ishedi ngokuthe ngqo kwi-pin flying wire.

I-chip kufuneka "ifakwe" kwibhodi yesiphaluka, okanye "i-soldering" ichanekile.I-chip kufuneka ithengiswe kwibhodi yesiphaluka, kwaye ibhodi yesiphaluka iseka uxhulumaniso lombane phakathi kwe-chip kunye ne-chip ngokusebenzisa "umkhondo".Ibhodi yesekethe ngumqhubi wamacandelo, angagcini nje ukulungisa i-chip kodwa iqinisekisa uxhulumaniso lombane kwaye iqinisekisa ukusebenza okuzinzile kwe-chip nganye.

iphini yetshiphu

Itshiphu inezikhonkwane ezininzi, kwaye itshiphu ikwaseka ubudlelwane bonxibelelwano lombane nezinye iitshiphusi, amacandelo, kunye neesekethe ngokusebenzisa izikhonkwane.Isebenza ngakumbi itshiphu, kokukhona iba nezikhonkwane.Ngokweendlela ezahlukeneyo ze-pinout, zinokwahlulwa zibe yi-LQFP series package, i-QFN series package, i-SOP series package, i-BGA series package kunye ne-DIP series in-line package.Njengoko kubonisiwe ngezantsi.

ibhodi PCB

Iibhodi zesekethe eziqhelekileyo zidla ngokuba neoli eluhlaza, ebizwa ngokuba ziibhodi zePCB.Ukongeza kokuluhlaza, imibala esetyenziswa ngokuqhelekileyo iblue, black, red, etc. Kukho iipads, traces, and vias on PCB.Ukucwangciswa kweepads kuhambelana nokupakishwa kwe-chip, kunye ne-chips kunye neepads zinokuthengiswa ngokuhambelana ngokudibanisa;ngelixa umkhondo kunye ne-vias zibonelela ngobudlelwane bonxibelelwano lombane.Ibhodi yePCB ibonisiwe kulo mfanekiso ungezantsi.

Iibhodi zePCB zinokwahlulwa zibe ziibhodi ezinomaleko-mbini, iibhodi ezinomaleko-mine, iibhodi ezinomaleko ezintandathu, kunye nezaleko ezingakumbi ngokwenani leeleya.Iibhodi ze-PCB ezisetyenziswa ngokuqhelekileyo ziyi-FR-4 izinto, kunye nobukhulu obuqhelekileyo 0.4mm, 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm, 2.0mm, njl. Le yibhodi yesekethe enzima, kunye nezinye. ithambile, ebizwa ngokuba yibhodi yesekethe eguquguqukayo.Umzekelo, iintambo eziguquguqukayo ezifana neefowuni eziphathwayo kunye neekhomputha ziibhodi zesekethe eziguquguqukayo.

izixhobo zokuwelda

Ukuthengisa i-chip, isixhobo sokuthambisa sisetyenziswa.Ukuba i-soldering manual, kufuneka usebenzise i-iron soldering iron, i-solder wire, i-flux kunye nezinye izixhobo.I-welding ye-manual ifanelekile kwinani elincinci leesampuli, kodwa ayifanelekanga kwi-welding ye-mass mass, ngenxa yokusebenza kakuhle, ukungaguquguquki okungahambi kakuhle, kunye neengxaki ezahlukeneyo ezifana ne-welding elahlekileyo kunye ne-welding yobuxoki.Ngoku iqondo lomatshini liya linyuka ngokunyuka, kwaye ukuwelda kwecandelo letshiphu ye-SMT yinkqubo yoshishino ekumgangatho oqolileyo.Le nkqubo iya kubandakanya oomatshini bokuxubha, oomatshini bokubeka, ii-ovens zokuphinda ziphume, uvavanyo lwe-AOI kunye nezinye izixhobo, kwaye iqondo lokuzenzekelayo liphezulu kakhulu., Ukuhambelana kuhle kakhulu, kwaye izinga lempazamo liphantsi kakhulu, eliqinisekisa ukuthunyelwa kobuninzi beemveliso ze-elektroniki.I-SMT kunokuthiwa ilushishino lweziseko ezingundoqo kushishino lombane.

Inkqubo esisiseko ye-SMT

I-SMT yinkqubo yoshishino esemgangathweni, ebandakanya i-PCB kunye nokuhlolwa kwezinto ezingenayo kunye nokuqinisekiswa, ukulayishwa komatshini wokubeka, i-solder paste / i-glue ebomvu yokuxubha, ukubeka umatshini wokubeka, i-oven yokutshiza, ukuhlolwa kwe-AOI, ukucocwa kunye nezinye iinkqubo.Akukho zimpazamo zinokwenziwa nakweliphi na ikhonkco.Ikhonkco lokujonga izinto ezingenayo ngokuyintloko liqinisekisa ukuchaneka kwezinto.Umatshini wokubeka kufuneka ucwangciswe ukumisela ukubekwa kunye nolwalathiso lwecandelo ngalinye.I-solder paste isetyenziswe kwiipads ze-PCB ngokusebenzisa i-mesh yensimbi.Isoldering engaphezulu kunye nereflow yinkqubo yokufudumeza kunye nokunyibilikisa intlama ye-solder, kwaye i-AOI yinkqubo yokuhlola.

I-chip kufuneka ithengiswe kwibhodi yesekethe, kwaye ibhodi yesekethe ayinakudlala kuphela indima yokulungisa i-chip kodwa iqinisekisa uxhulumaniso lombane phakathi kweetshiphu.