Ziziphi iindawo zokulawula inkqubo ephambili yokuvelisa iibhodi zeesekethe ezininzi

Iibhodi zeesekethe ze-Multilayer ngokubanzi zichazwa njenge-10-20 okanye ngaphezulu kweebhodi zesekethe ze-multilayer ze-high-grade, ezinzima kakhulu ukuqhubekeka kuneebhodi zesekethe ze-multilayer kwaye zifuna umgangatho ophezulu kunye nokuqina.Isetyenziswa kakhulu kwizixhobo zonxibelelwano, iiseva eziphezulu, i-elektroniki yezonyango, inqwelomoya, ulawulo lwamashishini, umkhosi kunye nezinye iinkalo.Kwiminyaka yakutshanje, imfuno yentengiso yeebhodi zeesekethe ezinamanqwanqwa amaninzi kwimimandla yonxibelelwano, izikhululo ezisisiseko, inqwelomoya, kunye nomkhosi isenamandla.
Xa kuthelekiswa neemveliso zePCB zemveli, iibhodi zesekethe ezinomaleko amaninzi zineempawu zebhodi etyebileyo, iileya ezingaphezulu, imigca eshinyeneyo, ngakumbi ngemingxunya, ubungakanani beyunithi enkulu, kunye nomaleko obhityileyo wedielectric.Iimfuno zesondo ziphezulu.Eli phepha lichaza ngokufutshane ubunzima obuphambili obujongene nokuveliswa kweebhodi zeesekethe eziphezulu, kwaye lizisa iingongoma eziphambili zokulawula iinkqubo eziphambili zokuvelisa iibhodi zeesekethe ezininzi.
1. Ubunzima bokulungelelaniswa kwe-inter-layer
Ngenxa yenani elikhulu leeleya kwibhodi yesekethe ye-multi-layer, abasebenzisi baneemfuno eziphezulu neziphezulu zokulinganisa iileya zePCB.Ngokuqhelekileyo, ukunyamezelwa kokulungelelaniswa phakathi kweengqimba kuqhutywe kwi-75 microns.Ukuqwalasela ubungakanani obukhulu beyunithi yebhodi yesekethe ye-multi-layer, ubushushu obuphezulu kunye nokufuma kwiworkshop yokuguqulwa kwemizobo, ukupakisha ukupakishwa okubangelwa kukungahambelani kweebhodi ezingundoqo ezahlukeneyo, kunye nendlela yokubeka i-interlayer, ulawulo oluphakathi lwe-multi-layer. ibhodi yesekethe ngakumbi nangakumbi nzima.
Ibhodi yesekethe ye-Multilayer
2. Ubunzima bokwenziwa kweesekethe zangaphakathi
Iibhodi zesekethe ezininzi zisebenzisa izixhobo ezikhethekileyo ezinje nge-TG ephezulu, isantya esiphezulu, isantya esiphezulu, ubhedu olungqingqwa, kunye neengqimba zedielectric ezincinci, ezibeka phambili iimfuno eziphezulu zokwenziwa kwesekethe yangaphakathi kunye nolawulo lobungakanani begraphic.Ngokomzekelo, ukunyaniseka kokuhanjiswa kwesignali ye-impedance yongeza ubunzima bokwenziwa kwesekethe yangaphakathi.
Ububanzi kunye nezithuba zomgca zincinci, iisekethe ezivulekileyo nezifutshane zongezwa, iisekethe ezimfutshane zongezwa, kwaye izinga lokupasa liphantsi;kukho iileya ezininzi zesignali zemigca ebhityileyo, kunye nokuba nokwenzeka kwe-AOI yokufunyaniswa kokuvuza kwinqanaba elingaphakathi liyenyuka;ibhodi yangaphakathi engundoqo ibhityile, kulula ukushwabana, ukungatyhileki kakuhle, kwaye kulula ukugoba xa kukrolwa umatshini;Iiplati eziphakamileyo eziphezulu ziyiibhodi zenkqubo, ubukhulu beyunithi bukhulu, kwaye iindleko zokuchithwa kwemveliso ziphezulu.
3. Ubunzima kwiCompression Manufacturing
Iibhodi ezininzi zangaphakathi ezingundoqo kunye neebhodi ze-prepreg zibekwe phezulu, ezibonisa ngokulula izinto ezingeloncedo zokutyibilika, i-delamination, i-resin voids kunye neentsalela ze-bubble kwimveliso yesitampu.Kuyilo lwesakhiwo se-laminate, ukumelana nobushushu, ukumelana noxinzelelo, umxholo weglue kunye nobukhulu be-dielectric yezinto kufuneka ziqwalaselwe ngokupheleleyo, kwaye isicwangciso esinengqiqo sebhodi yesekethe yebhodi yesekethe kufuneka yenziwe.
Ngenxa yenani elikhulu leengqimba, ukwandiswa kunye nokulawulwa kokunciphisa kunye nobungakanani bembuyekezo ye-coefficient ayikwazi ukugcina ukuhambelana, kwaye i-interlayer encinci ye-insulating layer ilula, ekhokelela ekungaphumeleli kovavanyo lokuthembeka kwe-interlayer.
4. Ubunzima kwimveliso yokomba
Ukusetyenziswa kwe-TG ephezulu, isantya esiphezulu, i-frequency ephezulu, kunye neepleyiti zobhedu ezishinyeneyo zonyusa ubunzima bokomba, ukugrumba i-burrs kunye nokucocwa.Inani leengqimba likhulu, ubukhulu bobhedu obupheleleyo kunye nobukhulu beplate buqokelelwe, kwaye isixhobo sokugaya kulula ukuphuka;ingxaki yokungaphumeleli kwe-CAF ebangelwa yi-BGA esasazwa ngokuxinana kunye nomngxuma omxinwa izithuba eludongeni;ingxaki yokugaya i-oblique ebangelwa ubuninzi beplate elula.PCB ibhodi yesekethe


Ixesha lokuposa: Jul-25-2022