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Ulawulo lwe-Thermal Ibhodi yeSekethe eprintiweyo (PCB)-SinkPAD TM
I-SinkPAD iulawulo olushushu oluprintiweyo lweBhodi yeSekethe (PCB) ubuchwephesheoko kwenza kube lula ukuqhuba ubushushu ngaphandle kwe-LED kunye ne-atmosfera ngokukhawuleza nangempumelelo kune-MCPCB eqhelekileyo.I-SinkPAD ibonelela ngokusebenza okuphezulu kwe-thermal kwi-LED yamandla aphakathi ukuya phezulu.
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Ixabiso eliphantsi Aluminiyam engundoqo elaminethiweyo ngefoyile yobhedu SinkPAD PCB
Yintoni i-Thermoelectric Separation Substrate?Iingqimba zesekethe kunye ne-thermal pad kwi-substrate ziyahlukana, kwaye isiseko se-thermal samacandelo e-thermal sithintana ngokuthe ngqo ne-hot-conducting medium ukufezekisa i-optimal conductive conductive thermal (zero resistance resistance).Izinto eziphathekayo ze-substrate ngokuqhelekileyo ziyintsimbi (iCopper) substrate. -
Indlela ethe ngqo yobushushu iMCPCB kunye neSink-pad MCPCB, iCopper Core PCB, iCopper PCB
IiNkcukacha zeMveliso iSiseko seMathiriyeli: I-Alu/ ukutyeba kobhedu kobhedu: 0.5/1/2/3/4 OZ Ukutyeba kweBhodi: 0.6-5mm Min.Ububanzi bomngxuma:T/2mm Min.Ububanzi bomgca: 0.15mm Min.Isithuba somgca: 0.15mm Surface Finishing:HASL,igolide yokuntywiliselwa,igolide edangazelayo,isilivere ecandiweyo,OSP Igama lento:MCPCB LED PCB eprintiweyo ibhodi yesekethe,Aluminiyam PCB,copper core PCB V-cut Angle:30°,45°,60°Shape ukunyamezela:+/-0.1mm Ukunyamezela kwe-DIA yomngxuma:+/-0.1mm Thermal Conductivity: 0.8-3 W/MK E-test voltage:50-250V Amandla e-Peel-off:2.2N/mm Warp okanye i-twist:
