Iibhodi zesekethe ze-PCB zisetyenziswa kakhulu eTshayina, kwaye ungcoliseko luya kuveliswa ngexesha lenkqubo yokwenziwa kweebhodi zesekethe eziprintiweyo, kubandakanywa uthuli kunye nobutyobo kwinkqubo yokwenziwa kwezinto ezifana neentsalela ze-flux kunye ne-adhesives.Ukuba ibhodi ye-pcb ayinakuqinisekisa ngokufanelekileyo indawo ecocekileyo, ukuxhathisa kunye nokuvuza kuya kubangela ukuba ibhodi ye-pcb ingaphumeleli, ngaloo ndlela ichaphazela ubomi benkonzo yemveliso.Ngoko ke, ukucoca ibhodi yesekethe ye-pcb ngexesha lenkqubo yokuvelisa linyathelo elibalulekileyo.
Ukucocwa kwe-Semi-aqueous ikakhulu kusebenzisa i-solvents eziphilayo kunye namanzi adibeneyo, kunye nomlinganiselo othile wezinto ezisebenzayo kunye nezongezo.Oku kucoca kuphakathi kokucoca i-solvent kunye nokucoca amanzi.Ezi zicoci zizinyibilikisi zendalo, izinyibilikisi ezinokutsha, indawo ene-flash ephezulu, ubutyhefu obuphantsi, kwaye zikhuselekile ukuzisebenzisa, kodwa kufuneka zihlanjwe ngamanzi emva koko zomiswe ngomoya.
Itekhnoloji yokucoca amanzi lukhokelo lophuhliso lwetekhnoloji ecocekileyo yexesha elizayo, kwaye kuyimfuneko ukuseka umthombo wamanzi acocekileyo kunye nokukhupha iworkshop yokucoca amanzi.Ukusebenzisa amanzi njengendlela yokucoca, ukongeza i-surfactants, i-additives, i-corrosion inhibitors kunye ne-chelating agents kumanzi ukwenza uluhlu lwee-agent ezisekelwe emanzini zokucoca.I-solvents enamanzi kunye ne-non-polar contaminants inokususwa.
Isetyenziswe kwinkqubo ye-soldering ngaphandle kokucoca i-flux okanye i-solder paste.Emva kwe-soldering, iya ngqo kwinkqubo elandelayo yokucoca, ayisekho iteknoloji yokucoca yasimahla okwangoku yeyona isetyenziswa kakhulu enye iteknoloji, ngakumbi iimveliso zonxibelelwano oluphathwayo ziyindlela yokusetyenziswa kwexesha elinye ukutshintsha i-ODS.Ukucoca i-solvent isetyenziselwa ukunyibilika kwe-solvent ukususa ukungcola.Ukucoca i-solvent kufuna izixhobo ezilula ngenxa yokuguquguquka ngokukhawuleza kunye nokunyibilika okuqinileyo.
Ixesha lokuposa: May-18-2022