Njengoko sonke sisazi, i-PCB ithanda ukugoba kwaye ijike xa idlula kwi-oveni yokubuyisela kwakhona.Uyithintela njani i-PCB ekugobeni nasekujikeni xa udlula kwi-oven yokubuyisela kwakhona ichazwe ngezantsi
1. Ukunciphisa impembelelo yobushushu kuxinzelelo lwePCB
Ekubeni "ubushushu" ngowona mthombo uphambili woxinzelelo lwepleyiti, okoko nje iqondo lobushushu le-reflow furnace liyancitshiswa okanye izinga lokufudumeza kunye nokupholisa ipleyiti kwisithando somlilo liyacotha, ukwenzeka kokugoba kwepleyiti kunye ne-warping kungancitshiswa kakhulu.Nangona kunjalo, kunokubakho ezinye iziphumo ezibi, ezifana ne-solder short circuit.
2. Yamkela ipleyiti yeTG ephezulu
I-TG yiqondo lokushisa lokutshintsha kweglasi, oko kukuthi, iqondo lokushisa apho izinto zitshintsha ukusuka kwiglasi ukuya kwimeko yerabha.Ixabiso eliphantsi le-TG lezinto eziphathekayo, ngokukhawuleza ipleyiti iqala ukuthamba emva kokungena kwi-reflow oven, kwaye ixesha elide lokuba yimeko ethambileyo yerabha, kokukhona kubi kakhulu ukuguqulwa kwepleyiti.Ukukwazi ukuthwala uxinzelelo kunye nokuguqulwa kunokunyuswa ngokusebenzisa ipleyiti ene-TG ephezulu, kodwa ixabiso lezinto eziphathekayo liphezulu.
3. Ukwandisa ubukhulu bebhodi yesekethe
Iimveliso ezininzi zombane ukuze kuphunyezwe injongo obhityileyo, ubukhulu ibhodi ishiywe 1.0 mm, 0.8 mm, okanye 0.6 mm, ubukhulu obunjalo ukugcina ibhodi emva komlilo reflow ayikhubeki, ngokwenene isuntswana. kunzima, kucetyiswa ukuba ukuba akukho mfuneko zincinci, ibhodi ingasebenzisa ubukhulu be-1.6 mm, enokunciphisa kakhulu umngcipheko wokugoba kunye nokuguqulwa.
4. Ukunciphisa ubungakanani bebhodi yesekethe kunye nenani leepaneli
Ekubeni ii-ovens ezininzi zokuhlaziya zisebenzisa amatyathanga ukuqhubela phambili iibhodi zeesekethe, ubukhulu bebhodi yesekethe enkulu, i-concave iya kuba kwi-oven yokubuyisela ngenxa yobunzima bayo.Ke ngoko, ukuba icala elide lebhodi yesekethe libekwe kwityathanga le-oven yokubuyisela kwakhona njengomda webhodi, i-concave deformation ebangelwa ubunzima bebhodi yesekethe ingancitshiswa, kwaye inani leebhodi lingancitshiswa. esi sizathu, Oko kukuthi, xa eziko, zama ukusebenzisa icala emxinwa perpendicular ukuya kwicala eziko, unako ukufikelela kwi sag deformation ephantsi.
5. Kusetyenziswe i-pallet fixture
Ukuba zonke ezi ndlela zingasentla kunzima ukufezekisa, Kukusebenzisa i-reflow carrier / template ukunciphisa ukuguqulwa.Isizathu sokuba i-reflow carrier / template inokunciphisa ukugoba kunye ne-warping yebhodi kukuba kungakhathaliseki ukuba kukwandiswa kwe-thermal okanye ukucutha okubandayo, i-tray ilindeleke ukuba ibambe ibhodi yesiphaluka.Xa iqondo lokushisa lebhodi yesiphaluka liphantsi kwexabiso le-TG kwaye liqala ukuqina kwakhona, linokugcina ubungakanani obujikelezileyo.
Ukuba itreyi enye-umaleko ayikwazi ukunciphisa deformation ibhodi yesekethe, kufuneka songeze umaleko isigqubuthelo ukubamba ibhodi yesekethe kunye maleko ezimbini iitreyi, nto leyo enokunciphisa kakhulu deformation ibhodi yesekethe ngokusebenzisa eziko reflow.Nangona kunjalo, le tray yomlilo ibiza kakhulu, kwaye ifuna ukongeza imanuwali ukubeka kunye nokuphinda kusetyenziswe itreyi.
6. Sebenzisa umzila endaweni ye-V-CUT
Ekubeni i-V-CUT iya kulimaza amandla okwakhiwa kweebhodi zeesekethe, zama ukungasebenzisi i-V-CUT yokwahlula okanye ukunciphisa ubunzulu be-V-CUT.
Ixesha lokuposa: Jun-24-2021