[I-Inner Circuit] i-substrate yefoyile yobhedu iqala isikwe kubungakanani obulungele ukusetyenzwa nokuveliswa.Ngaphambi kokucinezela ifilimu engaphantsi, ngokuqhelekileyo kuyimfuneko ukurhaxa ifoyile yobhedu kumphezulu wepleyiti ngokusila ibhrashi kunye ne-micro etching, kwaye emva koko uncamathisele ifilimu eyomileyo photoresist kuyo kwiqondo lobushushu elifanelekileyo kunye noxinzelelo.I-substrate efakwe kwi-photoresist yefilimu eyomileyo ithunyelwa kumatshini we-ultraviolet exposure ukuze ube sesichengeni.I-photoresist iya kuvelisa i-polymerization reaction emva kokuhlanjululwa yi-ultraviolet kwindawo ecacileyo ye-negative, kunye nomfanekiso womgca kwi-negative iya kudluliselwa kwi-photoresist yefilimu eyomileyo kwindawo yebhodi.Emva kokukrazula ifilimu ekhuselayo kumphezulu wefilimu, phuhlisa kwaye ususe indawo engakhanyisiweyo kumphezulu wefilimu kunye nesodium carbonate isisombululo esinamanzi, uze udle kwaye ususe ifoyile yobhedu evezwayo ngehydrogen peroxide isisombululo esixutywe ukwenza isekethe.Ekugqibeleni, i-photoresist yefilimu eyomileyo yasuswa ngesisombululo se-sodium oxide ekhanyayo.
[Ukucinezela] ibhodi yesekethe yangaphakathi emva kokugqitywa iya kudityaniswa nefoyile yobhedu yesekethe yangaphandle kunye nefilimu yeglasi yefiber resin.Ngaphambi kokucinezela, i-plate yangaphakathi iya kuba mnyama (i-oxygenated) ukuze idlulise indawo yobhedu kunye nokwandisa ukufakwa;Umphezulu wobhedu wesekethe yangaphakathi ukhutshiwe ukuvelisa ukunamathela kakuhle kunye nefilimu.Xa ukugqithisa, iibhodi zeesekethe zangaphakathi ezinamanqwanqwa angaphezu kwesithandathu (kubandakanywa) ziya kuhlanjululwa ngababini kunye nomatshini wokukhupha.Emva koko uyibeke kakuhle phakathi kweepleyiti zentsimbi yesibuko kunye nepleyiti yokubamba, kwaye uyithumele kwi-vacuum press ukuze uqine kwaye ubophe ifilimu ngobushushu obufanelekileyo kunye noxinzelelo.Umngxuma ekujoliswe kuwo webhodi yesekethe ecinezelweyo igrunjwa ngumatshini wokugrumba we-X-reyi wokumisa ngokuzenzekelayo njengomngxunya wesalathiso wokulungelelaniswa kweesekethe zangaphakathi nangaphandle.Umphetho wepleyiti uya kusikwa ngokufanelekileyo ukuququzelela ukusetyenzwa okulandelayo.
[Ukugaya] ukugrumba ibhodi yesekethe ngomatshini wokugaya we-CNC ukuze ubhobhoze umngxuma wesekethe ye-interlayer kunye nomngxuma wokulungisa weendawo zokuwelda.Xa kusetyenzwa, sebenzisa isikhonkwane ukulungisa ibhodi yesekethe kwitafile yomatshini wokugrumba ngomngxuma ekujoliswe kuwo ngaphambili, kwaye wongeze ipleyiti esezantsi esezantsi (ipleyiti ye-phenolic ester okanye ipleyiti yomthi) kunye nepleyiti ephezulu yokugquma (ipleyiti yealuminium) ukunciphisa ukwenzeka kwee-burrs zokomba.
[I-Plated through Hole] emva kokuba i-interlayer conduction channel yenziwe, umaleko wobhedu wesinyithi uya kucwangciswa kuwo ukuze ugqibezele ukuqhutyelwa kwe-interlayer circuit.Okokuqala, coca iinwele emngxunyeni kunye nomgubo kumngxuma ngokusila ibhrashi enzima kunye nokuhlamba koxinzelelo oluphezulu, kwaye ucwilise kwaye unamathisele i-tin eludongeni lomngxuma ococekileyo.
[I-Copper yokuqala] i-palladium colloidal layer, kwaye emva koko iyancipha ibe yintsimbi ye-palladium.Ibhodi yesiphaluka igxininiswe kwisisombululo sobhedu beekhemikhali, kwaye i-ion yobhedu kwisisombululo iyancitshiswa kwaye ifakwe eludongeni lomngxuma nge-catalysis ye-palladium metal ukwenza i-circuit-hole circuit.Emva koko, umaleko wobhedu kumngxuma wokutyhutyha ujiya nge-copper sulfate bath electroplating ukuya kubukhulu obaneleyo ukuxhathisa impembelelo yokusetyenzwa nokusingqongileyo kwenkonzo.
[Umgca wangaphandle weKhopha yesiSekondari] ukuveliswa kokudluliselwa komfanekiso womgca kufana nomgca wangaphakathi, kodwa kumgca wokulinganisa, wohlulwe kwiindlela zokuvelisa ezilungileyo nezingalunganga.Indlela yokuvelisa ifilimu engalunganga ifana nokuveliswa kwesekethe yangaphakathi.Igqitywe ngokufaka ngokuthe ngqo ubhedu kunye nokususa ifilimu emva kophuhliso.Indlela yokuvelisa ifilimu eqinisekileyo kukongeza ubhedu lwesibini kunye ne-tin lead plating emva kophuhliso (i-tin lead kule ndawo iya kugcinwa njenge-etching resist in the later copper etching step).Emva kokususa ifilimu, i-foil yobhedu evezwayo ikhutshwe kwaye isuswe nge-alkaline ammonia kunye ne-chloride yobhedu isisombululo esixutywe ukwenza indlela yocingo.Ekugqibeleni, sebenzisa isisombululo se-tin lead stripping ukukhupha umaleko we-tin oye wathatha umhlala-phantsi ngempumelelo (kwiintsuku zokuqala, i-tin lead layer igcinwe kwaye isetyenziselwa ukugubungela isiphaluka njengomaleko okhuselayo emva kokunyibilika kwakhona, kodwa ngoku ubukhulu becala buyanyibilika." ayisetyenziswanga).
[Ushicilelo lwe-Ink ye-Ink ye-Anti Welding] ipeyinti yokuqala eluhlaza yaveliswa ngokufudumeza ngokuthe ngqo (okanye ukukhanya kwe-ultraviolet) emva kokuprintwa kwesikrini ukwenza lukhuni ifilimu yepeyinti.Nangona kunjalo, kwinkqubo yokuprinta kunye nokuqina, isoloko ibangela ukuba ipeyinti eluhlaza ingene kwindawo yobhedu yoqhagamshelwano lwe-terminal yomgca, okubangela ingxaki ye-welding inxalenye kunye nokusetyenziswa.Ngoku, ukongeza ekusebenziseni iibhodi zesekethe ezilula nezirhabaxa, ziveliswa kakhulu ngepeyinti eluhlaza efotosensitive.
Umbhalo, uphawu lokuthengisa okanye inxalenye yenombolo efunwa ngumthengi iya kuprintwa ebhodini ngokuprintwa kwesikrini, kwaye i-inki yepeyinti yokubhaliweyo iya kuqiniswa ngokumisa okushushu (okanye i-ultraviolet irradiation).
[Ukusetyenzwa koQhagamshelwano] ukuwelda ipeyinti eluhlaza igubungela uninzi lomphezulu wobhedu wesekethe, kwaye kuphela abafowunelwa betheminali benxalenye yokuwelda, uvavanyo lombane kunye nokufakwa kwebhodi yesekethe baveziwe.Uluhlu olufanelekileyo olukhuselayo luya kongezwa kule ndawo yokuphela ukuphepha ukuveliswa kwe-oxide kwindawo yokugqibela yokudibanisa i-anode (+) ekusebenziseni ixesha elide, echaphazela ukuzinza kwesiphaluka kunye nokubangela iinkxalabo zokhuseleko.
[Ukubumba kunye nokusika] ukusika ibhodi yesekethe kwimilinganiselo yangaphandle efunwa ngabathengi ngomatshini wokubumba we-CNC (okanye i-punch die).Xa usika, sebenzisa ipini ukulungisa ibhodi yesiphaluka kwibhedi (okanye isikhunta) ngokusebenzisa umngxuma wokumisa owenziwe ngaphambili.Emva kokusika, umnwe wegolide uya kugaywa kwi-angle oblique ukuququzelela ukufakwa kunye nokusetyenziswa kwebhodi yesiphaluka.Kwibhodi yesekethe eyenziwe ngeetshiphusi ezininzi, imigca yekhefu efana ne-X kufuneka yongezwe ukuququzelela abathengi ukuba bahlukane kwaye badibanise emva kweplagi-in.Ekugqibeleni, hlambulula uthuli kwibhodi yesiphaluka kunye nokungcola kwe-ionic phezu komhlaba.
[Ukupakishwa kweBhodi yoHlolo] ukupakishwa okuqhelekileyo: ukupakishwa kwefilimu ye-PE, ukupakishwa kwefilimu eshwabeneyo ubushushu, ukupakishwa kwevacuum, njl.
Ixesha lokuposa: Jul-27-2021