Xa ucingo lobhedu lwe-PCB luwa, zonke iimpawu ze-PCB ziya kuxoxa ukuba yingxaki ye-laminate kwaye zifuna izityalo zabo zemveliso ukuba zithwale ilahleko embi.Ngokweminyaka emininzi yamava okuphatha isikhalazo sabathengi, izizathu eziqhelekileyo zokuwa kobhedu lwePCB zezi zilandelayo:
1,Imiba yenkqubo yefektri yePCB:
1), ifoyile yobhedu igqitywe ngaphezulu.
Ifoyile yobhedu ye-Electrolytic esetyenziswa kwimarike idla ngokuba yigalvanized enecala elinye (eyaziwa ngokuba yi-ashing foil) kunye nokufakwa kwecala elinye lobhedu (okuqhelekileyo kwaziwa njengefoyile ebomvu).Ukwaliwa kobhedu okuqhelekileyo yifoyile yobhedu eyenziwe ngegalvanized ngaphezu kwe-70UM.Akukhange kubekho ukwaliwa kobhedu lwebhetshi kwifoyile ebomvu kunye nefoyile eqhumayo ngaphantsi kwe-18um.Xa uyilo lwesekethe lungcono kunomgca we-etching, ukuba i-foil yobhedu iyatshintsha kwaye i-parameters ye-etching ihlala ingatshintshi, ixesha lokuhlala kwi-foil yobhedu kwisisombululo se-etching liya kuba lide kakhulu.
Ngenxa yokuba i-zinc iyintsimbi esebenzayo, xa ucingo lobhedu kwi-PCB lufakwe kwisisombululo se-etching ixesha elide, luya kukhokelela ekugqithiseni umgca wecala, okukhokelela ekuphenduleni okupheleleyo komgca obhityileyo oxhasa i-zinc layers kunye nokwahlula. i-substrate, oko kukuthi, ucingo lobhedu luyawa.
Enye imeko kukuba akukho ngxaki nge-PCB etching parameters, kodwa ukuhlanjwa kwamanzi kunye nokomisa emva kwe-etching akubi kakuhle, okubangela ukuba ucingo lobhedu lujikelezwe sisisombululo se-residual etching kumphezulu we-toilet ye-PCB.Ukuba ayiphathwanga ixesha elide, iya kuvelisa i-corrosion engaphezulu yecala locingo lobhedu kwaye iphose ubhedu.
Le meko igxile kwindlela yomgca obhityileyo okanye imozulu emanzi.Iziphene ezifanayo ziya kuvela kuyo yonke iPCB.Khulula intambo yobhedu ukuze ubone ukuba umbala womphezulu wokudibanisa kunye nomgangatho wesiseko (okt into ebizwa ngokuba yi-coarsened surface) utshintshile, owahlukileyo kumbala wefoyile yobhedu eqhelekileyo.Into oyibonayo ngumbala wobhedu woqobo womaleko ongezantsi, kwaye amandla exolo efoyile yobhedu kumgca ongqindilili nawo aqhelekile.
2), Ungquzulwano lwasekhaya lwenzeka kwinkqubo yokuvelisa i-PCB, kwaye ucingo lobhedu lwahlulwe kwi-substrate ngamandla omatshini angaphandle.
Kukho ingxaki ekubekweni kwalo msebenzi umbi, kwaye ucingo lobhedu oluwileyo luya kuba nokuphazamiseka okucacileyo, okanye imikrwelo okanye amanqaku empembelelo kwicala elinye.Khulula intambo yobhedu kwindawo embi kwaye ujonge kwifoyile yobhedu kwindawo erhabaxa.Kuya kubonakala ukuba umbala we-foil yobhedu ebusweni buqhelekile, awuyi kuba ne-corrosion yecala, kwaye amandla okuhluthwa kwe-foil yobhedu aqhelekileyo.
3), uyilo lwesekethe yePCB alunangqiqo.
Ukuyila imigca ebhityileyo kakhulu ngefoyile yobhedu eshinyeneyo kuya kubangela ukuchetywa kwemigca egqithileyo kunye nokwaliwa kobhedu.
2,Isizathu senkqubo yeLaminate:
Phantsi kweemeko eziqhelekileyo, okoko nje icandelo lobushushu obuphezulu bobushushu belaminate lidlula imizuzu engama-30, ifoyile yobhedu kunye nephepha elihlanjululweyo zidityaniswe ngokupheleleyo, ngoko ke ukucinezela ngokuqhelekileyo akuyi kuchaphazela amandla okudibanisa phakathi kwefoyile yobhedu kunye nephepha lobhedu. i-substrate kwi-laminate.Nangona kunjalo, kwinkqubo ye-lamination kunye ne-stacking, ukuba i-PP ingcolisekile okanye indawo enqabileyo ye-foil yobhedu yonakalisiwe, iya kukhokelela kumandla anganeleyo okudibanisa phakathi kwe-foil yobhedu kunye ne-substrate emva kwe-lamination, okubangelwa ukuphambuka kokubeka (kuphela kwiipleyiti ezinkulu) okanye ucingo lobhedu oluwa manqaphanqapha, kodwa akusayi kubakho kungaqhelekanga kukuqina kwexolo lefoyile yobhedu kufutshane ne-off-line.
3,Laminate isizathu sezinto ezikrwada:
1), Njengoko kukhankanyiwe ngasentla, ifoyile yobhedu eqhelekileyo ye-electrolytic yenziwe ngesinyithi okanye iimveliso zobhedu ezenziwe ngefoyile yoboya.Ukuba ixabiso lencochoyi yefoyile yoboya aliqhelekanga ngexesha lemveliso, okanye amasebe ekristale yokugquma ahlwempuzekile ngexesha lokugalela / ukucwenga ubhedu, okukhokelela ekungoneleni kokuqina kwexolo lefoyile yobhedu ngokwayo.Emva kokuba i-foil embi icinezelwe kwi-PCB, ucingo lobhedu luya kuwa phantsi kwempembelelo yamandla angaphandle kwiplagi-in ye-electronic factory.Olu hlobo lokuphoswa kobhedu alulunganga.Xa ucingo lobhedu lukhutshiwe, akusayi kubakho mhlwa ocacileyo kwindawo erhabaxa yefoyile yobhedu (oko kukuthi umphezulu wokudibana ne-substrate), kodwa amandla exolo efoyile yobhedu yonke aya kuba mbi kakhulu.
2), Ukulungelelaniswa okungalunganga phakathi kwefoyile yobhedu kunye ne-resin: kwezinye iilaminates ezineempawu ezikhethekileyo, ezifana neshidi leHTG, ngenxa yeenkqubo ezahlukeneyo ze-resin, i-agent ephilisayo esetyenziswayo ngokubanzi i-PN resin.I-molecular chain structure ye-resin ilula kwaye idigri yokudibanisa i-cross iphantsi ngexesha lokunyanga.Kubophelelwe ukusebenzisa i-foil yobhedu kunye nencopho ekhethekileyo ukuyifanisa.Xa ifoyile yobhedu esetyenziselwa ukuveliswa kwe-laminate ayihambelani nenkqubo ye-resin, okubangela ukungonelanga amandla e-peel ye-foil yesinyithi egqunywe kwipleyiti, kunye nocingo olubi lobhedu oluwa xa lufaka.
Ixesha lokuposa: Aug-17-2021