I-Shenzhen ekumgangatho ophezulu we-aluminium PCB MCPCB ene-Taiyo PSR-4000 uthotho lwemaski esulungekileyo yesoda emhlophe
Isakhono sokuVelisa:
into | Ukukwazi ukwenza |
Izinto eziphathekayo | FR4,CEM-1, iAluminium, iPoly amide |
Uluhlu No. | 1-12 |
Ugqitywe ubukhulu bebhodi | 0.1 mm-4.0mm |
Ukunyamezela ukutyeba kweBhodi | ±10% |
Cooper ubukhulu | 0.5 OZ-3OZ (18 um-385 um) |
Umngxuma wokuPlatha ubhedu | 18-40 um |
Ulawulo loMbane | ±10% |
I-Wap & Jika | 0.70% |
Peel uyakwazi | 0.012"(0.3mm)-0.02'(0.5mm) |
Imifanekiso
Ububanzi obuncinci bokulandelela (a) | 0.075mm (3mil) |
Ububanzi besithuba esincinci (b) | 0.1mm (4 mil) |
Min Annular Ring | 0.1mm (4 mil) |
I-SMD Pitch (a) | 0.2 mm(8 milli) |
I-BGA Pitch (b) | 0.2 mm (8 milli) |
Imaski yeSolder
Min Solder Mask Dam (a) | 0.0635 mm (2.5mil) |
Ukususwa kwesigqubuthelo semaski (b) | 0.1mm (4 mil) |
Isithuba esincinci sePad SMT (c) | 0.1mm (4 mil) |
Ukutyeba kweMaski yeSolder | 0.0007"(0.018mm) |
Imingxuma
Ubungakanani bomngxuma omncinci (CNC) | 0.2 mm (8 milli) |
Min Punch Hole Ubungakanani | 0.9 mm (35 mil) |
Ubungakanani bomngxuma TOL (+/-) | PTH:±0.075mm;NPTH: ±0.05mm |
Isikhundla somngxuma TOL | ±0.075mm |
Ukucwenga
I-HASL | 2.5um |
Khokela iHASL yasimahla | 2.5um |
Ukuntywiliselwa kweGolide | Nickel 3-7um Au:1-5u'' |
OSP | 0.2-0.5um |
Ulwandlalo
Ulwandlalo lwePaneli ye-TOL (+/-) | I-CNC: ± 0.125mm, Ukubetha: ± 0.15mm |
Beveling | 30°45° |
Gold Finger angle | 15° 30° 45° 60° |
Isatifikethi | ROHS, ISO9001:2008, SGS, isatifikethi se-UL |
Singakwenzela:
1-12 umaleko FR4 PCB.
1-2 umaleko aluminiyam PCB.
1-4 umaleko bhetyebhetye PCB.
CEM-1 PCB
94VO PCB
Inkonzo yendibano ye-SMT kunye ne-DIP.
Bhala umyalezo wakho apha kwaye uwuthumele kuthi