Ulawulo lwe-Thermal Ibhodi yeSekethe eprintiweyo (PCB)-SinkPAD TM
Uluhlu: Iileya ezi-1
Izinto eziphathekayo: Isiseko seAluminiyam
I-Thermal conductivity: 210.0w/mk
Ubukhulu bebhodi: 2.0mm
Ubunzima bobhedu: 2.o oz
Unyango lomphezulu: LF HASL
Imaski yeSolder: Mnyama
Isikrini sesilika: Mhlophe
Imvelaphi: eTshayina
Ukwahlula iThermoelectric:I-SinkPADIteknoloji
Isicelo: Iimveliso zonyango
I-SinkPADTMItekhnoloji inobungakanani obuphezulu bokusebenza kwe-thermal kuneyona MCPCB ibalaseleyo kwimarike.I-SinkPADTMI-MCPCB ifumaneka ngesiseko sentsimbi yeAluminiyam okanye isiseko sentsimbi yeCopper.I-Aluminiyam esekwe kwi-SinkPADTMI-PCB inokudlulisa ubushushu ngesantya se-210.0 W/mK kunye neSinkPAD esekwe kwiCopperTMI-PCB inokudlulisa ubushushu kwizinga le-385.0 W / mK ngelixa i-MCPCBs eqhelekileyo inezinga lokudlulisa ukushisa kwe-1-5 W / mK Indlela esinokuyifeza ngayo olu phuculo olumangalisayo kukudala iNdlela ye-Thermal Direct ukusuka kwi-LED ukuya kwisiseko. intsimbi.