I-36W PCB enebhodi yeSensor Ceiling Fan
Iinkcukacha eziKhawulezayo:
Uhlobo:I-PCB eqinileyo
Izinto ezisisiseko: FR4 TG140
Ukutyeba kobhedu:1OZ/2OZ
Ukutyeba kwebhodi: 1mm
Min.Ubungakanani bomngxuma: 0.01mm
Min.Ububanzi bomgca: 0.02mm
Min.Isithuba somgca: 0.01mm
Ukugqitywa komphezulu:HASL
Ubungakanani bebhodi:Yenzelwe wena
Ubushushu bokusebenza:-5℃-60℃
Inani leeleya:IiLayiri eziMbini
Ubushushu bokugcina:-20℃-80℃
Ixabiso lombane osebenzayo: AC100V-250V
Umbala wemaski yeSolder:Mnyama.Obomvu.Yellow.White.Blue.Green
Umgangatho wePCB:IPC-A-610 E
Ubuchule be-SMT:BGA.QFP.SOP.QFN.PLCC.CHIP
Uvavanyo lweNdibano ye-PCB:UHlolo oluBonakalayo (olumiselweyo), i-AOI, i-FCT, i-X-RAY
IiSubstrates Material:Aluminiyam, 22F,CEM-1,CEM-3,FR4
Ukutshatyalaliswa kwamandla ombane: 2.0-2.4KV(AC)
Ingcaciso yeMveliso
Intsebenziswanoindlela:
1. Uyilo olucwangcisiweyo: iskimu sesekethe sinokuyilwa ngokweemfuno zomthengi.
2, uyilo lwePCB: Idayagram yePCB inokuyilwa ngokwesicwangciso esivela kumthengi.I-PCB kunye ne-bill yezinto eziphathekayo zinokuhlahlelwa kwisiseko seesampuli zabathengi.
3, Uyilo lweSoftware: Uphuhliso lwesoftware yeSCM kunye noyilo, lunokubhalwa ngokweemfuno zomthengi, kunye nomsebenzi ofunekayo.Okanye phinda ubhale inxalenye yesoftware ukuze ilingane ihardware yomthengi.
Indlela yentsebenziswano yemveliso:
1. Iprogram ebhaliweyo, i-schematic, idatha ye-PCB kunye ne-bill of materials inokuthunyelwa kumthengi ukwenzela ukuqhutyelwa kweprogram kunye neebhodi zeesekethe.
I-2, sinokuyila inkqubo yomthengi, sincede ukuvelisa iibhodi zeesekethe ngokweemfuno zomthengi.Intsebenziswano yeendlela ezininzi ukuhlangabezana neemfuno ezahlukeneyo zabathengi.
3, Uphuhliso kunye noyilo, intlawulo ephantsi.kuphela iindleko kunye neentlawulo zophuhliso ezifunekayo, ezinokuthi zibuyiswe emva kwexabiso elithile lee-odolo.Ingaphuhliswa kwaye iyilwe ngokusekelwe kwiimfuno zenkqubo yomthengi.
I-PCB UKWENZA UKWENZA :
1 | Iileya | Icala elinye, i-2 ukuya kwi-18 Layer |
2 | Uhlobo lwezinto zebhodi | I-FR4,CEM-1,CEM-3,ibhodi ye-ceramic substrate,ibhodi aluminiyam esekwe, High-TG, Rogers kunye nokunye |
3 | I-lamination yezinto ezidibeneyo | 4 ukuya kwi-6 imigangatho |
4 | Ubuninzi bomlinganiselo | 610 x 1,100mm |
5 | Ukunyamezela komlinganiselo | ±0.13mm |
6 | Ukugubungela ubukhulu bebhodi | 0.2 ukuya 6.00mm |
7 | Ukunyamezela ubukhulu bebhodi | ±10% |
8 | DK ubukhulu | 0.076 ukuba 6.00mm |
9 | Ubuncinci bobubanzi bomgca | 0.10mm |
10 | Ubuncinci besithuba somgca | 0.10mm |
11 | Umaleko wangaphandle ubukhulu bobhedu | 8.75 ukuya 175µm |
12 | Umaleko wangaphakathi ubukhulu bobhedu | 17.5 ukuya 175µm |
13 | Ukugrumba umngxuma ubukhulu (ukuqhuba ngomatshini) | 0.25 ukuba 6.00mm |
14 | Idayimitha yomngxuma egqityiweyo (uqheliso lomatshini) | 0.20 ukuba 6.00mm |
15 | Unyamezelo lwedayamitha yomngxuma (ukuqhuba ngomatshini) | 0.05mm |
16 | Unyamezelo lwendawo yomngxuma (ukuqhuba ngomatshini) | 0.075mm |
17 | Laser drill ubungakanani umngxuma | 0.10mm |
18 | Ubukhulu bebhodi kunye nomlinganiselo wedayamitha yomngxuma | 10:1 |
19 | Uhlobo lwemaski yeSolder | Buhlaza, Mthubi, Mnyama, Msobo, Buso, Mhlophe naBomvu |
20 | Ubuncinci imaski yesolder | Ø0.10mm |
21 | Ubuncinci bobungakanani beringi yokwahlula imaski ye-solder | 0.05mm |
22 | I-Solder imaski yeplagi yeplagi ye-oyile yomngxuma ububanzi | 0.25 ukuba 0.60mm |
23 | Ukunyamezela kokulawula ukunyamezela | ±10% |
24 | Ukugqitywa komphezulu | Inqanaba lomoya oshushu, i-ENIG, isilivere yokuntywiliselwa, iplating yegolide, intiyi yokuntywiliselwa kunye nomnwe wegolide |