Ukuthengiswa okushushu kwe-HDI Multilayer FR4 PCB Iibhodi zeSekethe zeMicro SD Card
Iinkcukacha eziKhawulezayo:
Ukutyeba kobhedu:1 oz
Ukutyeba kwebhodi: 1.0mm
Min.Ubungakanani bomngxuma: 0.20mm
Min.Ububanzi bomgca: 0.075mm
Min.Isithuba somgca: 0.075mm
Ukugqitywa komphezulu: ENIG
Ubungakanani bebhodi:Yenzelwe wena
Imaski yeSolder Umbala:I-Inki eluhlaza
Ukunyamezela ukutyeba kwebhodi:+/-10%
V-cut angle:25°,30°,45°,60°
Jika&Ukusonga:≤ 0.5%
Ifayile:Pro tel 99se/P-CAD/Auto cad/Cam350
Ukupakisha kwangaphakathi:Ukupakishwa kwevacuum,ingxowa yeplastiki
Ukupakisha kwangaphandle:Ukupakishwa kweekhathoni eziqhelekileyo
Inkonzo:PCB & PCBA
Umaleko:6 umaleko
Imaski yesilika:Mhlophe
IiNkcazo zeeMveliso
1 | Inkcazo | Inkcazo yePCB |
2 | Izinto eziphathekayo | FR-4/HTG150-180 FR-4/CEM-1/CEM-3/Aluminiyam |
3 | Umaleko | 1-20 |
4 | Ukutyeba kweBhodi | 0.2mm-4.0mm |
5 | Ukunyamezela ukutyeba kweBhodi | +/-10% |
6 | Ubunzima bobhedu | 17.5um-175um (0.5oz-5oz) |
7 | Min Trace Ububanzi | 0.15mm |
8 | Min Space Ububanzi | 0.15mm |
9 | Min Drilling Dia | 0.2mm |
10 | PTH ubukhulu bobhedu | 0.4-2mil(10-50um) |
11 | Ukunyamezela kwe-Etching | ±1mil(±25um) |
12 | I-angle ye-V-cut | 25°,30°,45°,60° |
13 | IPearl Amandla omgca | ≥ 6lb/ngaphakathi(≥ 107g/mm) |
14 | Ulawulo lwe-impedance kunye nokunyamezela | 50Ω±10% |
15 | Jija&Gqiba | ≤ 0.5% |
16 | Imaski yesolder | Buhlaza, Bubomvu, Buzuba, Mhlophe, Mnyama, Mthubi |
17 | Ukugqitywa komphezulu / ukuPlayika | HASL/Lead Free HASL/OSP/Gold Plating/Immersion Gold/ENIG |
18 | Isatifikethi | ROSH.ISO9001 |
19 | Ifayile | Protel 99se/P-CAD/Auto cad/Cam350 |
20 | Ukupakisha kwangaphakathi | Ukupakishwa kwevacuum, Ingxowa yePlastiki |
21 | Ukupakisha kwangaphandle | Ukupakishwa kweebhokisi eziqhelekileyo |
Umzi mveliso wethu:
Bhala umyalezo wakho apha kwaye uwuthumele kuthi