Directed thermal conductivity CREE XML Copper MCPCB printing circuit board 5050 LED PCB hand light plate Featured Image

Ibhodi yoshicilelo lwebhodi yesekethe yoshicilelo lwe-thermal CREE XML CREE XML Copper MCPCB 5050 LED PCB hand plate plate

FR4 ulwazi lwebhodi

Ibhodi yeFR4 ephambili iimpawu zobugcisa kunye nesicelo: ukuzinza kombane wokugquma kombane, ukuthambeka okuhle, umphezulu ogudileyo, akukho mingxunya, ukunyamezela ukutyeba kunomgangatho, olungele ukusetyenziswa kwiimfuno zokufakelwa kombane ezikumgangatho ophezulu wemveliso, njengepleyiti yokuqinisa i-FPC, iziko letin, ubushushu obuphezulu. ipleyiti ukumelana, carbon diaphragm, ukuchaneka swimming ivili, uvavanyo PCB, zombane (zombane) isixhobo ukugquma ipleyiti, ipleyiti yokugquma, iindawo zokugquma i-transformer, ukugqunywa kombane, ukuphambuka kwebhodi yekhoyili yekhoyili, ibhodi yokugquma ibhodi yombane, njl.

Thumela i-imeyile kuthi

Iinkcukacha zeMveliso

Ulwazi malunga nomthamo wenkqubo yenkampani yethu kwireferensi yakho:

Into	Ukukwazi ukwenza
Izinto eziphathekayo	FR-4 / Hi TG FR-4 / Izinto ezikhokelayo zasimahla (i-ROHS iyahambelana) /CEM-3, iAluminium, iMetal esekwe
Uluhlu No.	1-16
Ubunzima beBhodi obugqityiweyo	0.2 mm-3.8mm'(8 mil-150 mil)

Ukunyamezela ukutyeba kweBhodi	±10%
Cooper ubukhulu	0.5 OZ-11OZ (18 um-385 um)
Umngxuma wokuPlatha ubhedu	18-40 um
Ulawulo loMbane	±10%
I-Wap & Jika	0.70%
Peel uyakwazi	0.012″(0.3mm)-0.02'(0.5mm)
Imifanekiso
Ububanzi obuncinci bokulandelela (a)	0.1mm (4 mil)
Ububanzi besithuba esincinci (b)	0.1mm (4 mil)
Min Annular Ring	0.1mm (4 mil)
I-SMD Pitch (a)	0.2 mm(8 milli)
I-BGA Pitch (b)	0.2 mm (8 milli)

Imaski yeSolder
Min Solder Mask Dam (a)	0.0635 mm (2.5mil)
Ukususwa kwesigqubuthelo semaski (b)	0.1mm (4 mil)
Isithuba esincinci sePad SMT (c)	0.1mm (4 mil)
Ukutyeba kweMaski yeSolder	0.0007″(0.018mm)
Imingxuma
Ubungakanani bomngxuma omncinci (CNC)	0.2 mm (8 milli)
Min Punch Hole Ubungakanani	0.9 mm (35 mil)
Ubungakanani bomngxuma TOL (+/-)	PTH:±0.075mm;NPTH: ±0.05mm
Isikhundla somngxuma TOL	±0.075mm
Ukucwenga
I-HASL	2.5um
Khokela iHASL yasimahla	2.5um
Ukuntywiliselwa kweGolide	Nickel 3-7um Au:1-5u”
OSP	0.2-0.5um
Ulwandlalo
Ulwandlalo lwePaneli ye-TOL (+/-)	I-CNC: ± 0.125mm, Ukubetha: ± 0.15mm
Beveling	30°45°
Gold Finger angle	15° 30° 45° 60°
Isatifikethi	ROHS, ISO9001:2008, SGS, isatifikethi se-UL

Ubungakanani	16x16mm
Ukutyeba	1.6MM
unyango olungaphezulu	khokela iHASL yasimahla
imaski solder	mhlophe
ubukhulu bobhedu	1oz
umthombo okhokelwayo	CREE XML

FR4 ulwazi lwebhodi

Iimpawu zeplate ye-aluminium

1.Ukusebenzisa itekhnoloji yokubeka umphezulu (SMT)

2.Kuyilo lwesekethe yokusasazwa kwe-thermal lunyango olusebenzayo kakhulu

I-3.Ukushisa okuphantsi kokusebenza, ukuphucula ubuninzi bamandla kunye nokuthembeka, ukwandisa ubomi benkonzo yeemveliso;

4.Nciphisa ubungakanani beemveliso zethu, ukunciphisa iindleko ze-hardware kunye nendibano

5.Endaweni ye-brittle substrates ceramic, ukunyamezela komatshini okungcono

Ipleyiti yeAluminiyam IYASEBENZISA: I-IC yamandla exutyiweyo (HTC)

1.Izixhobo zomsindo: :I-amplifier yokufaka kunye nemveliso, i-amplifier elinganayo, isandisi somsindo, i-preamplifier, i-amplifier yamandla, njl.

2.Isixhobo sombane : Ukutshintsha umlawuli ` DC/AC converter ` SW isilawuli, njl.

3.Isixhobo sonxibelelwano sombane :Ukonyuka kwamaza aphezulu ` ukuhluza umbane ` isekethe yokuhambisa.

4.Izixhobo ezizisebenzelayo zeOfisi :IiMotor drives, njl.

5.Ikhompyuter:Isixhobo sombane se-CPU sebhodi yefloppy drive, njl.

ImiGaqo eneenkcukacha zePCBINdibano

Imfuno yobugcisa:

1) Ubuchwephesha bokunyuswa koMphezulu kunye neTekhnoloji ye-solder ye-Three-hole

2) Ubungakanani obahlukeneyo njenge-1206,0805,0603 itekhnoloji yeSMT

3) I-ICT (kuVavanyo lweSekethe), i-FCT(Uvavanyo oluSebenzayo lweSekethe) ubuchwepheshe.

I-4) I-Nitrogen igesi yokuphinda ithengise iteknoloji ye-SMT.

I-5) Umgca weNdibano ye-SMT ephezulu kunye ne-Solder

6) Uxinaniso oluphezulu oludityanisiweyo lweteknoloji yokubeka ibhodi.

singakwenzela ntoni ?

a)1-16 umaleko FR-4 PCB ibhodi, 1-2 umaleko Aluminium PCB.

b)1-6 oz ubukhulu bobhedu.

c)0.2 mm ubungakanani bomngxuma.

d)0.1 mm ububanzi bomgca/isithuba.

e) uyilo lwePCB kunye noyilo.

f)Indibano,ukuthengwa kwecandelo.

I-PCBS yethu isetyenziselwa uluhlu olubanzi lweemveliso zombane

Njengezixhobo zonyango, iCCTV, ukubonelela ngombane, iGPS, i-UPS, iBhokisi yokuSeta,

Telecommunication, LED, njl.

Iimveliso zethu :

PCB, MCPCB, FPC, Multi.umaleko we-PCB, i-PCB eguquguqukayo eqinile, i-LEDS(Edison, Cree)

Iipleyiti ze-aluminiyam ezisemgangathweni ophezulu

Iisubstrates zobhedu

Iinxalenye zentsimbi

Iinxalenye zeCeramic

Amacwecwe aKhethekileyo-uRogers, i-polytetrafluoroethylene, i-TG iibhodi zesekethe ye-microwave ephezulu-frequency kunye neebhodi zesekethe eziguquguqukayo

Usetyenziselwa uku…

ukukhanya kwesilingi, ukukhanya kwebala, ukukhanya okuphantsi, ukukhanya koyilo, isibane esilengayo, ukukhanya kwangaphakathi, ukukhanya kwekhitshi, ukukhanya okulengayo, ukukhanya kwendlu yangasese, isibane ...