I-PTR/IR Sensor Eprintiweyo yeBhodi yeSekethe yePCB yokuLawula ukukhanya kwe-LED
Iinkcukacha zeMveliso
Izinto ezisisiseko:MCPCB
Ukutyeba kobhedu: 0.5-3OZ
Ukutyeba kwebhodi: 0.2-3.0mm
Min.Ubungakanani bomngxuma: 0.25mm / 10mil
Min.Ububanzi bomgca: 0.1mm / 4mil
Min.Isithuba somgca: 0.1mm/4mil
amandla ombane: 12V 24V
Ukugqitywa komphezulu: I-Antioxidant, i-lead-free / i-toti etshizwe ngelothe, ikhemistri
amandla ombane:36W
uhlobo loluvo:PIR motion sensor
ubukhulu: 17mm * 10mm
impahla:PCB
Isicelo:Inzwa yentshukumo
Ityala leProjekthi
Ukwaziswa kwe-MCPCB
I-MCPCB sisishunqulelo se-Metal core PCBS, kuquka i-aluminium esekwe kwi-PCB, i-PCB esekwe elubhedu kunye ne-PCB esekwe ngentsimbi.
Ibhodi esekelwe kwi-Aluminiyam lolona hlobo luqhelekileyo.Izinto ezisisiseko ziquka i-aluminium core, i-FR4 eqhelekileyo kunye nobhedu.Ibonisa umaleko we-thermal clad ochitha ubushushu ngendlela efanelekileyo kakhulu ngelixa ukupholisa amacandelo.Okwangoku, iAluminiyam esekwe kwiPCB ithathwa njengesisombululo kumandla aphezulu.Ibhodi esekelwe kwi-aluminium ingathatha indawo yebhodi esekelwe kwi-ceramic, kwaye i-aluminium inika amandla kunye nokuqina kwimveliso iziseko ze-ceramic zingenako.
I-Copper substrate yenye yezona zixhobo zetsimbi ezibiza kakhulu, kwaye i-thermal conductivity yayo ingcono ngamaxesha amaninzi kune-aluminium substrates kunye ne-iron substrates.Ilungele ukutshatyalaliswa kobushushu obuphezulu beesekethe eziphezulu zefrikhwensi, amacandelo kwimimandla enenguqu enkulu kwiqondo lokushisa eliphezulu neliphantsi kunye nezixhobo zonxibelelwano ezichanekileyo.
I-Thermal insulation layer yenye yeendawo eziphambili ze-copper substrate, ngoko ubukhulu be-foil yobhedu ubukhulu becala yi-35 m-280 m, enokufikelela kumthamo oqinileyo wangoku.Xa kuthelekiswa ne-aluminium substrate, i-copper substrate inokufezekisa umphumo ongcono wokutshatyalaliswa kobushushu, ukwenzela ukuba kuqinisekiswe ukuzinza kwemveliso.
Ubume beAluminiyam PCB
ISekethe yeCopper Layer
Umaleko wobhedu wesekethe uphuhliswa kwaye uhlonyelwe ukwenza isekethe eprintiweyo, i-substrate ye-aluminium inokuthwala umsinga ophakamileyo kune-FR-4 efanayo kunye nobubanzi obufanayo.
I-Insulating Layer
Uluhlu lwe-insulating yi-teknoloji engundoqo ye-aluminium substrate, eyona nto idlala imisebenzi ye-insulation kunye nokushisa ukushisa.I-aluminium substrate insulating layer iyona mqobo omkhulu we-thermal kwisakhiwo semodyuli yamandla.Okungcono ukuhanjiswa kwe-thermal ye-insulating layer, ngokusebenzayo ngakumbi ukusasaza ubushushu obuveliswa ngexesha lokusebenza kwesixhobo, kunye nokunciphisa ubushushu besixhobo,
I-Metal substrate
Luluphi uhlobo lwetsimbi esiya kukhetha njenge-insulating metal substrate ?
Kufuneka siqwalasele i-coefficient yokwandisa i-thermal, i-thermal conductivity, amandla, ubunzima, ubunzima, umgangatho womhlaba kunye neendleko ze-substrate yensimbi.
Ngokuqhelekileyo, i-aluminiyam inexabiso eliphantsi kunobhedu.Izinto ezifumanekayo ze-aluminiyam ziyi-6061, 5052, 1060 njalo njalo.Ukuba kukho iimfuno eziphakamileyo ze-thermal conductivity, iipropathi zomatshini, iipropathi zombane kunye nezinye iimpawu ezikhethekileyo, iipleyiti zobhedu, iiplate zetsimbi ezingenasici, iipleyiti zetsimbi kunye neentsimbi ze-silicon nazo zingasetyenziswa.