Low-cost Aluminum core laminated copper foil SinkPAD PCB Featured Image

Ixabiso eliphantsi Aluminiyam engundoqo elaminethiweyo ngefoyile yobhedu SinkPAD PCB

Yintoni i-Thermoelectric Separation Substrate?

Iingqimba zesekethe kunye ne-thermal pad kwi-substrate ziyahlukana, kwaye isiseko se-thermal samacandelo e-thermal sithintana ngokuthe ngqo ne-hot-conducting medium ukufezekisa i-optimal conductive conductive thermal (zero resistance resistance).Izinto eziphathekayo ze-substrate ngokuqhelekileyo ziyintsimbi (iCopper) substrate.

Thumela i-imeyile kuthi

Iinkcukacha zeMveliso

Iinkcukacha zePCB

Uhlobo lwePCB	I-SinkPAD II Technology
Ubungakanani bePCB	50.0×60.0mm
Ubume	Iibhodi zeSangqa
Uhlobo lweMetal yesiseko	Aluminiyam
Gqibezela Ukutyeba	0.062 intshi (1.57 mm)
Indlela ethe ngqo yeThermal	EWE
I-Thermal Conductivity	240.0 W/mK
Umphezulu Gqiba	LF HASL
Glass Transition Temp.	170 degrees Celsius
Ivunyiwe UL	Ewe
Ukuthotyelwa kweRoHS	Ewe